Tata Electronics finalized five separate agreements during the Semicon India event on Friday, September 18, 2026. The company formed alliances with Sumitomo Chemical, Kelington, Enomoto, Sojitz Corporation, NRS Corporation, and L&T Semiconductor to support local chip manufacturing operations.
An agreement with Japan-based Sumitomo Chemical focuses on supplying semiconductor materials such as photoresists and functional chemicals alongside high-purity chemicals including hydrogen peroxide, isopropyl alcohol, ammonia water, and sulfuric acid. These supplies are designated for Tata Electronics’ upcoming fabrication facility located in Dholera, Gujarat.
Additionally, the partnership involves supporting Sumitomo Chemical in investigating the local manufacturing of these materials and chemicals within India.
The collaboration with Malaysian integrated engineering solutions provider Kelington is intended to advance the operational readiness of the Dholera fab project. Kelington will supply critical infrastructure, systems integration, and engineering capabilities, while both companies will work on developing local talent and engineering capabilities in India.
Packaging And Supply Chain Alliances
Partnering with Japan-based Enomoto, Tata Electronics plans to support packaging readiness at its Jagiroad facility in Assam and investigate the localization of lead frame manufacturing. This arrangement includes assessing opportunities for technology transfer, engineering collaboration, and capability development.
Tata Electronics is constructing this high-volume packaging facility in Jagiroad, Assam, with an investment of $3 billion.
Sojitz Corporation and NRS Corporation entered into a collaboration to build a semiconductor materials supply chain supporting the Dholera foundry project.
The partnership with L&T Semiconductor Technologies Limited combines fabless design innovation with Tata Electronics’ foundry and packaging capabilities. Both entities will jointly study chip fabrication and packaging opportunities for current and future products across automotive, industrial, communications, security, and intelligent-edge sectors, incorporating chip design to fabrication optimizations.
